One of the largest university-based facilities - working at the intersection of biology and engineering.
Research Facilities
MNTL is one of the country's largest and most sophisticated university facilities for conducting photonics, microelectronics, biotechnology, and nanotechnology research. Our 15 class 100 and 1000 cleanrooms, 46 general purpose labs, and 2,500 square foot biosafety level-2 bionanotechnology complex contain all the tools researchers need to conduct their work.
Cleanroom Access Bionanotech Lab Access Device Characterization Lab Access
- Fang wins NSF Career Award
Holonyak Lab Assistant Professor Kejie Fang recently won a prestigious NSF CAREER award for his proposal on cavity-less optomechanics with macroscopic resonances.
- Gong receives IEEE Ultrasonics Early Career Investigation Award
Holonyak Lab Associate Professor Songbin Gong was recently awarded the IEEE Ultrasonics Early Career Investigator Award for his group's work with lithium niobate lamb wave microacoustic devices for radio frequency applications.
- Holonyak Lab professors named as OSA Fellows
Two Holonyak Micro & Nanotechnology Laboratory professors, Lynford L. Goddard and Xiuling Li, have been named as Fellows of the Optical Society (OSA).
- Holonyak Lab student receives Outstanding Presentation Trophy at GCURS
Jarod Meyer has taken full advantage of the undergraduate research opportunities at Illinois and won an Outstanding Presentation Trophy at this year’s GCURS.
- Illinois team develops first of a kind in-vitro 3D neural tissue model
Researchers at the University of Illinois at Urbana-Champaign have successfully used stem cells to engineer living biohybrid nerve tissue to develop 3D models of neural networks with the hopes of gaining a better understanding of how the brain and these networks work.
- New heat model may help electronic devices last longer
Holonyak Lab engineers have found that the model currently used to predict heat loss in a common semiconductor material does not apply in all situations. This new understanding can help chip manufacturers find ways to better diffuse heat.