HMNTL to install state-of-the-art equipment in cleanroom

1/15/2021 Lizzie Roehrs, HMNTL

Thanks to an Investment for Growth grant from the Office of the Provost at the University of Illinois, Holonyak Micro and Nanotechnology Laboratory (HMNTL) is adding new state-of-the-art fabrication tools in its cleanrooms.

Written by Lizzie Roehrs, HMNTL

Thanks to an Investment for Growth grant from the Office of the Provost at the University of Illinois, Holonyak Micro and Nanotechnology Laboratory (HMNTL) is adding new state-of-the-art fabrication tools in its cleanrooms. New pieces include a Dual-frequency Plasma Enhanced Chemical Vapor Deposition (PECVD) and an ICP-RIE from Oxford, a Metal Evaporator and Metal Sputterer from Lesker, and a 150kV E-Beam Lithography (EBL) system from Elionix.

According to Mark McCollum, HMNTL principal research engineer, the EBL tool has a higher energy capability than any other in North America. This high-precision tool will allow HMNTL researchers and students to print features as small as four nanometers in size.

“This lithography tool uses a tightly focused beam of electrons as a controlled ‘pen’,” says McCollum. “When we cover the surface of a sample with a material which is sensitive to the energy of the incoming electron beam, we can print extremely fine details into the E-Beam resist.”

PECD is used to deposit a thin layer of silicon dioxide, silicon nitride, or a mixture of both to the surface of a sample. PECVD yields some of the fastest deposition rates while maintaining film quality when compared to other methods of deposition.                         

“The energy we need for the reaction of incoming gases is provided from radio frequency (RF) generators,” says McCollum. “This tool has two different frequencies, which we can use to control the stress of the deposited layers. This allows us to deposit layers with high compressive or tensile stress or completely relaxed with no stress. All of these options are part of important research programs at HMNTL."

"The metals evaporator and metals stutterer are used to deposit metals from a pure source. While their uses are similar, the mechanisms are very different," he said. "The  evaporator focuses and scans an electron beam on the surface of pure metal. The heated metal will evaporate and move through a high vacuum and become deposited on the surface of a sample across the chamber from the metal source. In sputtering, we use a plasma to create positive Argon ions. The impact of the Argon ions will break the surface bonds of the metal on the face of the target and they will leave the target and land on the sample placed nearby.”

The ICP-IRE is already installed and includes both Chlorine- and Freon-based chemistries. According to McCollum, this allows for a wider variety of materials to be etched. In addition to the wide variety of uses, the tool also allows for short repeated etch steps referred to as Atomic Layer Etch. This tool is also the first of its kind in North America and is already being used for work with a local company.

“We enjoy an incredible history of device experts and device developments at UIUC,” says McCollum. “We are excited to be updating these tools to give us the capability of leading in the important research of today. We are grateful for the Investment for Growth financing and the dedicated support of the Grainger College of Engineering.”

 

 

 


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This story was published January 15, 2021.