Oxford Freon ICP-RIE

The Oxford Freon ICP-RIE system is used primarily for etching dielectrics. The tool is load-locked and is currently configured to etch small samples through 100mm wafers. This system has an Ocean Optics endpoint detector. It is capable of processing at temperatures from -10°C up to 50°C. Metals are not allowed in the system. Etch gases are CH2F2, C4F8, CHF3, SF6, CF4, Ar, and O2.