EVG 620 Double-Sided Mask Aligners

The EVG 620 is a semi-automatic contact/proximity photolithography 365 nm mask aligner capable of one-micron front-side and two-micron back-side alignment accuracy. The aligner is currently configured with a 5-inch mask plate holder for aligning 4-inch wafers. It can be modified up to 7-inch mask plate holder for 150 mm wafers and down to a 4-inch mask plate holder for 3-inch wafers. Smaller samples can also be aligned.

• Standard EVG recipe on AZ1505 resist
• Photomask=light field, Cr/Quartz
• 3inch Si wafer, wafer thickness=380um
• PR=AZ1505
• Spin coating=1000rpm 10sec with Ramp=100rpm/sec, 5000rpm 40sec with Ramp=250rpm/sec, PR thickness=860nm
• Remove edge bead
• Soft bake=110C 1min EVG-620 aligner: Standard mode soft contact exposure, Dose=45mJ/cm2
• Development: MIF917 30sec
• Diener O2 descumming: recipe 5, 1min