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Disco DAD-6TM Wafer Dicing Saw

Disco DAD-6TM Wafer Dicing Saw

Photo of Disco DAD

The Disco Automatic Dicing Saw is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate wafers with diameters from 2” to 6”.

Instruction Set