XACTIX XeF2 Etching System
The XACTIX XeF2 etching system is an isotropic silicon etching system. XeF2 etching is a dry, room temperature process. It is particularly well suited to MEMS applications. This system can provide nearly infinite selectivity of silicon to photoresist, SiO2, Si3N4, Al, and Cr. The system process chamber can accommodate individual die, pieces of wafer, and full wafers up to 6” in diameter. The recipe-driven control software will manage multiple users and log all process data.