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Oxford Instruments Plasmalab System100 ICP RIE

Oxford Instruments Plasmalab System100 ICP RIE

Photo of Oxford Instruments Plasmalab System100 ICP RIE

The Oxford Instruments Inductively Coupled Plasma Reactive Ion Etch system is used exclusively for the etching III-V compound semiconductors. The tool is load-locked and is currently configured to handle 4-inch wafers.

The Oxford system has a laser interferometer reflectance detector and also an optical emission endpoint detector. It is capable of processing at temperatures from 0°C up to 350°C.

Metals are not allowed in the system.

The gases connected to the process chamber are: SiCl4, BCl3, Cl2, CH4, Ar, O2, H2, and SF6. (SF6 is only used in the chamber cleaning process.)