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Oxford Chlorine ICP-RIE

Oxford Chlorine ICP-RIE

The Oxford Cl ICP-RIE system is used exclusively for the etching III-V compound semiconductors. The tool is load-locked and is currently configured to etch small samples through 100mm wafers. This system has a laser interferometer reflectance detector and an optical emission endpoint detector. It is capable of processing at temperatures from 0°C up to 50°C. Metals are not allowed in the system. Etch gases are SiCl4, BCl3, Cl2, CH4, Ar, O2, and H2.