Oxford Instruments Plasmalab System100 Freon ICP RIE
The Oxford Instruments Inductively Coupled Plasma Reactive Ion Etch system is used for the etching Si3N4, SiO2 and Si. The tool is load-locked and is currently configured to handle 4-inch wafers.
The Oxford system has an optical emission endpoint detector. It is capable of processing at temperatures from -20°C up to 50°C.
SU8, Kapton tape and LiNbO3 are not allowed in the system.
The gases connected to the process chamber are: SF6, C4F8, O2, Ar, CHF3, CF4, and CH2F2.Operating Procedure