Cambridge NanoTech Atomic Layer Deposition System
The Cambridge NanoTech Atomic Layer Deposition System is capable of producing very high quality deposition of both Aluminum Oxide and Hafnium Oxide Films. By using this precision thin film coating methodology, the ALD system is able to deposit a film one atomic layer at a time thus allowing digital thickness control to the atomic level. These depositions result in pinhole free films with very uniform thickness across the sample surface. This precision thin film coating methodology can be used to deposit conformal, uniform films on substrates with aspect ratios of greater than 2000:1. Sample temperature is 250C for the deposition process and no metals or polymers are allowed in this system.
More details of this process can be found at http://www.cambridgenanotechald.com/atomic-layer-deposition.html.