Micro & Nanoelectromechanical M/NEMS Integrated Systems illustration

Micro & Nanoelectromechanical M/NEMS Integrated Systems

About Micro & Nanoelectromechanical M/NEMS Integrated Systems

The Micro and Nanoelectromechanical M/NEMS Integrated Systems area is developing micromachining methods for a variety of materials such as silicon, compound semiconductors, silicon carbide, piezoelectric films, and polymers to enable applications in many interdisciplinary areas, including wireless communications (VHF to sub-THz frequencies), optoelectronics, imaging, and biomedical engineering.

Faculty & Research Groups

Faculty with primary interest in this area