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Micro and Nanotechnology Laboratory | U of I

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Micro and Nanotechnology Laboratory
208 North Wright Street Urbana, Illinois 61801


Office hours 8:30a - 5:00p


Phone: 217-333-3097
Fax: 217-244-6375


Kulicke & Soffa 4524AD Ball Bonder


The Model 4524AD Multi-Process Auto Stepback Ball Bonder for gold wire is ideal for Research & Development and small production lots where unique processes are used. Single point TAB, ball bumping, and coining, together with standard ball bonding, offer process flexibility and versatile capabilities. Semi-auto manual and automatic operation modes, individual bond parameter control and a wide range of wire diameters make it ideal for a variety of applications. The new digital option enables programming of unique bonding schedules. Up to 200 different bonding programs may be stored in the memory. The built-in programmable Negative Electronic Flame-Off (N.E.F.O.) system provides consistency and fine control of ball size.

User Manual (.pdf file)

Request Training (need to provide your own cap, you should purchase UTS-38JH-AZM-1/16-16MM from Small Precision Tools)

For more information contact Edmond Chow

Last Updated: Nov 2013