Facilities
Highlights
FSM Film Stress Measurement System
Description:
The FSM 500TC is a film stress measurement system that can test the stress of different films on different substrates, such as SiO2/Si, Si3N4/GaAs, etc. The system can also test coefficient of thermal expansion (CTE) of the films. It has an N2 ambient and a programmable temperature control system, allowing the evaluation of the thermal properties and stability of the films at temperature ranging from room up to 500⁰C. The FSM 500TC accommodates wafer from 2” to 8” (50 to 200mm).