FSM Film Stress Measurement System
The FSM 500TC is a film stress
measurement system that can test the stress of different films on different
substrates, such as SiO2/Si, Si3N4/GaAs, etc.
The system can also test coefficient of thermal expansion (CTE) of the films. It
has an N2 ambient and a programmable temperature control system,
allowing the evaluation of the thermal properties and stability of the films at
temperature ranging from room up to 500⁰C. The FSM 500TC accommodates wafer from
2” to 8” (50 to 200mm).
Click here for FSM Manual