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Micro and Nanotechnology Laboratory | U of I

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CONTACT US

 

Micro and Nanotechnology Laboratory
208 North Wright Street Urbana, Illinois 61801

 

Office hours 8:30a - 5:00p

 

Phone: 217-333-3097
Fax: 217-244-6375
email: mntl@illinois.edu

facilities

Disco DAD-6TM Wafer Dicing Saw

Disco DAD-6TM Wafer Dicing Saw

Description:

The Disco Automatic Dicing Saw is a precision machine used to cut semiconductor wafers into individual chips or dice. Wafers are held to the chuck table by means of vacuum and the chuck can accommodate wafers with diameters from 2” to 6”.

Instruction Set