Oxford Instruments Plasmalab System100 ICP RIE
The Oxford Instruments Inductively Coupled Plasma Reactive Ion Etch system is used exclusively for the etching III-V compound semiconductors. The tool is load-locked and is currently configured to handle 4-inch wafers.
The Oxford system has a laser interferometer reflectance detector and also an optical emission endpoint detector. It is capable of processing at temperatures from 0°C up to 350°C.
Metals are not allowed in the system.
The gases connected to the process chamber are: SiCl4, BCl3, Cl2, CH4, Ar, O2, H2, and SF6. (SF6 is only used in the chamber cleaning process.)