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Micro and Nanotechnology Laboratory
208 North Wright Street Urbana, Illinois 61801


Office hours 8:30a - 5:00p


Phone: 217-333-3097
Fax: 217-244-6375


Oxford Instruments Plasmalab System100 ICP RIE

STS Advanced Silicon Etcher


The Oxford Instruments Inductively Coupled Plasma Reactive Ion Etch system is used exclusively for the etching III-V compound semiconductors. The tool is load-locked and is currently configured to handle 4-inch wafers.

The Oxford system has a laser interferometer reflectance detector and also an optical emission endpoint detector. It is capable of processing at temperatures from 0°C up to 350°C.

Metals are not allowed in the system.

The gases connected to the process chamber are: SiCl4, BCl3, Cl2, CH4, Ar, O2, H2, and SF6. (SF6 is only used in the chamber cleaning process.)