Idonus HF Vapor System
The Idonus HF Vapor Phase Etching System (Idonus
HF VPE-100/150) is used to etch SiO2.
It provides a variety of new processing options
for MEMS fabrication. The system
consists of a reaction chamber, a wafer holder,
and a controller. The wafer holder accommodates small substrate pieces as well
as wafers up to 6” in diameter. A heating element is integrated into the wafer
holder. The etching rate can be controlled by adjusting the wafer temperature
from 35°C to 60°C. The etching process can also be done at room temperature.