Facilities
Highlights
GCA DSW-6100 G-Line Series Wafer Stepper
Description:
This tool uses a g-line (436 nm) lens column ( 0.30 N/A) to provide a 5:1 reduction with a variable field size up to 2 cm square. The number and placement of the dies is programmable. Minimum feature size is less than 0.9 um. Various diameter wafers can be accommodated, as well as smaller pieces. 5" reticles are used. There are some restrictions on what substrate thicknesses can be accommodated in this system.
Features:
Step and repeat exposure system with laser-controlled
stage motion
Zeiss 5X reduction lens with 0.30 numerical aperture
G-line (436 nm) exposure wavelength
20 x 20 mm field size
Resolution to 0.9 µm
Overlay accuracy to <0.25 µm