EVG 620 Mask Aligners
The EVG 620 is an i-line (365 nm) mask aligner capable of 0.5 micron feature resolution and can attain one-micron frontside and two-micron backside alignment accuracy (based on the operator’s ability). The aligner is currently configured with a 5-inch mask plate holder (for aligning 4-inch wafers) and can accommodate masks of different thicknesses. A 7-inch mask plate holder (for 6-inch wafers) is also available, and a 4-inch mask plate holder (for 3-inch wafers) is on order. Smaller wafers and pieces can be aligned with the appropriate chuck.
Please contact the superuser if you are interested in getting training on this tool.